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Principle of magnetron sputtering
Nov 09, 2016

Magnetron sputtering coating is a new type of physical vapor deposition method, compared with the earlier evaporation coating method, its advantages are obvious. As a mature technology, magnetron sputtering has been used in many fields.


Magnetron sputtering coating is a new type of physical vapor deposition method, compared with the earlier evaporation coating method, its advantages are obvious. As a mature technology, magnetron sputtering has been used in many fields.


Magnetron sputtering principle: in sputtering target (cathode) with an orthogonal magnetic field and electric field and the anode, in high vacuum chamber filled with inert gases needed (usually Ar), the permanent magnet forms 250 to 350 Gauss magnetic field on the target surface, with high electric group into orthogonal electromagnetic field. Under the influence of electric field, Ar gas ionization into ions and electrons, the target with a high negative voltage, and the working gas under the action of magnetic field from the electronic target from the ionization probability increases, the formation of a high density plasma near the cathode, the role of Ar ions in the Lorentz force under the accelerated toward the target surface. At very high speed bombarding target surface, the target was sputtered atoms follow the momentum conversion principle with high kinetic energy from the target surface to substrate deposited film. Magnetron sputtering is generally divided into two types: a tributary of the sputtering and RF sputtering, which is a tributary of the sputtering equipment is simple, in the sputtering of metal, the rate is also fast. The radio frequency sputtering is more widely used, in addition to the conductive material, it can also be used as a non conducting material, and the material of oxide, nitride and carbide can be prepared by reactive sputtering. If the RF frequency is improved after microwave plasma sputtering, the current commonly used electron cyclotron resonance (ECR) type microwave plasma sputtering.


The main application field of sputtering: decorative thin film, architectural glass, automotive glass, Low-E glass, flat panel display, optical communication and optical data storage industry, light industry, optical data storage, magnetic data storage industry


Magnetron sputtering target: metal alloy sputtering target, sputtering target, sputtering ceramic target, boride ceramic sputtering carbide ceramic sputtering fluoride ceramic sputtering nitride ceramic oxide ceramic target sputtering, selenide ceramic sputtering ceramic silicide sputtering sulfide ceramic sputtering telluride other ceramic sputtering ceramic target, chromium doped silicon oxide ceramic target (Cr-SiO), indium phosphide (InP), the target of arsenic lead target (PbAs), InAs target (InAs).


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